Thick Film Chip Dividers, High Voltage

Features

• High voltage up to 3000 V
• Typical resistance ratios of 250:1 to a maximum resistance ratio of 500:1
• Flow solderable
• Tape and reel packaging available
• Termination style: 3-sided wraparound termination or single termination flip chip available
• Suitable for solderable, epoxy bondable, or wire bondable applications
• Termination material: solder-coated nickel barrier or solder coated non-magnetic terminations standard; gold, palladium silver, platinum gold, platinum silver or platinum palladium gold terminations available
• Multiple styles, termination materials and configurations, allow wide design flexibility
• Epoxy bondable or wire bondable non-magnetic terminations available
• Standard solder plating for the nickel barrier and non-magnetic parts is solder terminations E or T. Hot solder dipped terminations F or S are also available
• Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring solderable mounting
• While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver. If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for solderability and/or solder joint issues